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QBITronic Solutions

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Practical Knowledge
With innovation

Our Smart Training Programs Designed for You

Qbitronics solutions delivered more than just training – We deliver a commitment to quality that builds trust and powers the next generation of industry leaders. Through our experts’ hands-on training programs, we are dedicated to empowering aspiring professionals.

Hardware Design - Concept to Circuit

Duration: 3 months
The course develops end-to-end skills in hardware system design, from requirement analysis and schematic creation to PCB layout and prototyping.
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What’s Inside this course?

This course provides a comprehensive, hands-on journey through the entire hardware design lifecycle—from requirement analysis and system architecture to schematic capture, PCB layout, and prototyping. Learners will gain the skills to design, simulate, and implement real-world digital hardware systems using industry-standard tools and practices.

Dynamic Course Structure

Designed & Delivered by Industry Experts

Hardware Design Curriculum

Section 1: Discuss the Requirement sheet. and Processor NXP S32G2 Datasheet in very detail.
Section 2: How to Choose a SDRAM (SDR/DDRX/LPDDRX) ?ItsPin Mapping and Schematic Design From Datasheet.
Section 3: Selection and Schematic Design of PMIC (Power Management IC) in very Details.
Section 4: EMMC (Embedded Multimedia Card) Chip Selection, Pin Mapping and Schematic Design.
Section 5: Ethernet-Multigig Module Selection, Selection and Schematic Design.
Section 6: Selection of External LDO/DC-DC/Buck-Boost and Their Schematic Design in very Details.
Section 7: Schematic Design of S32G2, Pin Mapping and Impedances Planning on Schematic through Net-Classes.
Section 8: Layer Stack up(4/6/8/12L),Finish the Components Placement Planning and its Execution Part-1
Section 9: Components Placement Planning and its Execution Part-2
Section 10: Components Placement Planning and its ExecutionPart-3
Section 11: Layout Planning, Preliminary Layout, High Speed Design Rules and Length Matching, Power Plane Planning by Sections, Optimization of Layout
Section 12, 13: Power Plane Planning by Sections, Optimization of Layout.
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The information above is preliminary and subjected to change.

High Speed IO – PCIe/USB/UFS/ DDR

Duration: 3 months
The course develops the knowledge and practical skills to design, simulate, and validate high-speed I/O interfaces such as PCIe, USB, UFS, and DDR.
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What’s Inside this course?

This course covers the design, simulation, and validation of high-speed I/O interfaces including PCIe, USB, UFS, and DDR. Learners will gain hands-on experience with industry tools, understand protocol-level requirements, and apply best practices in layout, signal integrity, and compliance testing using industry-standard instruments.

Dynamic Course Structure

Designed & Delivered by Industry Experts

High Speed IO Design – PCIe/USB/UFS/ DDR

Section 1: Introduction to High-Speed Interfaces

  • Evolution of high-speed I/O
  • Importance of signal integrity and power integrity
  • Overview of PCIe, USB, UFS, DDR protocols
  • Eye diagrams, jitter, crosstalk, skew

Section 2: Protocol Deep Dive

PCI Express (PCIe)

  • Architecture and layers
  • Gen1 to Gen5 overview
  • Lane bonding, equalization, and link training

USB (2.0, 3.x, 4.0)

  • USB architecture and signaling
  • Power delivery and Type-C
  • USB PHY and protocol stack

UFS (Universal Flash Storage)

  • UFS vs eMMC
  • UniPro and M-PHY layers
  • Command queuing and performance

DDR (DDR3/4/5)

  • Timing and topology (Fly-by, T-branch)
  • Read/write leveling
  • Termination and impedance control

Section 3: Design Methodology

  • Schematic design best practices
  • Differential pair routing
  • Impedance control and stack-up planning
  • Power delivery network (PDN) design

Section 4: Simulation Techniques

  • Pre-layout vs post-layout simulation
  • Signal Integrity (SI) and Power Integrity (PI)
  • Tools: Cadence Sigrity, HyperLynx, ADS
  • Eye diagram analysis, TDR, S-parameters

Section 5: Validation and Testing

  • Lab equipment: Oscilloscopes, BERTs, VNAs
  • Compliance testing and debugging
  • Protocol analyzers and sniffers
  • Case studies: PCIe Gen4 validation, DDR5 timing closure

Section 6: Hands-On Labs / Projects

  • Simulate a PCIe channel and analyze eye diagram
  • DDR4 timing simulation and margin analysis
  • USB 3.1 signal integrity validation
  • UFS layout review and simulation

Section 7: Industry Case Studies & Trends

  • Real-world design challenges
  • Emerging standards (CXL, LPDDR5X, USB4 v2)
  • Design for manufacturability and testability
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The information above is preliminary and subjected to change.

Signal and Power integrity Analysis

Duration: 3 months
The course develops with the theoretical and practical skills to analyze, simulate, and mitigate signal and power integrity issues in high-speed digital and mixed-signal systems, ensuring robust and reliable hardware performance.
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What’s Inside this course?

This course provides a deep understanding of signal and power integrity (SI/PI) principles in high-speed digital systems, enabling learners to identify, analyze, and mitigate issues such as reflections, crosstalk, ground bounce, and power noise. The course emphasizes practical simulation techniques, measurement methods, and design strategies to ensure reliable performance in PCB and system-level hardware.

Dynamic Course Structure

Designed & Delivered by Industry Experts

Signal Integrity Basics and Simulations

1. High Speed Signals – What is Signal Integrity?
2. What is a PCB Transmission Line?
3. What is Impedance?
4. Return Current – What is Return Current in a PCB? Return Current Path – Can Power Planes be used as Return Path?
5. What is Single Ended Impedance?
6. What is Differential Impedance and Differential Signals ?
7. What is LVDS Signaling Scheme? Working of LVDS and IBIS Simulations LVDS Simulation and Measurements
9. What is an EYE Mask? Create an Eye Mask Using Datasheets
8. What is Eye Diagram in Digital Communication?
10. What Is Crosstalk? Near End and Far End Crosstalk (NEXT & FEXT)
11. What is Reflection in a Transmission Line? Simulation of Reflection in LPDDR4
12. What are Even and Odd modes? Estimate the Even and Odd Mode Impedances
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The information above is preliminary and subjected to change.

Silicon Power/Performance

Duration: 3 months
The course develops a deep understanding of power-performance trade-offs in silicon design, enabling learners to analyze, model, and optimize power consumption and performance across various levels of semiconductor systems—from transistor to SoC.
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What’s Inside this course?

This course develops a deep understanding of SoC/Silicon power-performance tradeoffs in VLSI design and their relation with thermal stability, and enabling learners to analyze, model, and optimize power consumption and performance across the corners.

Dynamic Course Structure

Designed & Delivered by Industry Experts

Silicon Power/Performance

1: Introduction
  • 1.1. CMOS Fundamentals – Power
  • 1.2. Power optimization techniques
  • 1.3. Power supplies overview
  • 1.4. DC-DC converter fundamentals
  • 1.5. PMIC building blocks overview
  • 1.6. Types of AC/DC parameters
2. Power Characterization
2.1. Types of Corners – PVT overview
2.2. Voltage droop measurement
2.3. Voltage plan execution
2.4. Vmin analysis across corners
2.5.power-perf – Avearge vs Peak power basics
3. Thermal Characterization
  • 3.1. Power-Thermal relationship
  • 3.2. Thermal design fundamentals
4. SoC building blocks
  • 4.1. Memory Hierarchy – power/performance dependency
  • 4.2. Core power – CPU/GPU/NSP
  • 4.3. Types of Performance Metrics for CPU/GPU/NSP/DDR
5. Lab measurement tools – Power/Thermal
6. Performance tools– Benchmarking for CPU/GPU/NSP/Camera/Display
7. Results Analysis techniques – RCA
8. Executive summary – FPC
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The information above is preliminary and subjected to change.

RF & EMI/EMC Design & Analysis

Duration: 3 months
The course develops RF circuit design and electromagnetic compatibility. Learners will gain skills to analyze, simulate, and mitigate EMI/EMC issues for compliant and robust electronic systems.
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What’s Inside this course?

To equip learners with the theoretical foundation and practical skills needed to design, analyze, and troubleshoot RF circuits and ensure electromagnetic compatibility (EMC) in electronic systems. The course covers RF fundamentals, signal propagation, EMI sources, shielding, filtering, and compliance with global EMC standards.

Dynamic Course Structure

Designed & Delivered by Industry Experts

RF & EMI/EMC Design & Analysis Course

1: Introduction to Electromagnetic Compatibility
2: EMC Requirements for Electronic Systems
3: Signal spectral analysis
4: Two and three conductor transmission lines
5: Elemental Radiators
6: Radiated Emission
7: Radiated Susceptibility
8: Conducted Emission
9: Conducted Susceptibility
10: Cross talk
11: Shielding and ESD
12: System Design for EMC
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The information above is preliminary and subjected to change.

ARM SoC Fundamentals

Duration: 3 months
The course develops principles, and practical implementation of architecture and design principles of ARM-based System-on-Chip (SoC) platforms. It covers ARM core fundamentals, bus architectures, memory systems, peripheral integration, and embedded software development.
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What’s Inside this course?

This course develops complete understanding of ARM architecture and ARM-based System-on-Chip (SoC) platforms. It covers ARM architecture core fundamentals, processor cores, AMBA bus architectures, peripheral integration, architecture extensions and trace & debug architecture.

Dynamic Course Structure

Designed & Delivered by Industry Experts

ARM/SoC Fundamentals

1: Introduction
  • 1.1. About ARM
  • 1.2. ARM – SoC example
2: Architecture Fundamentals
2.1 Architecture Overview
  • 2.1.1. Legacy-Architecture
  • 2.1.2. V7
  • 2.1.3. V8
2.2. Instruction Set – A32/T32/A64
2.3. V7A and V8A Architecture overview
2.4. Architecture extensions basics
  • 2.4.1. Trustzone - Security
  • 2.4.2. Virtualization
2.5. Processors cores overview – Cortex A/R/M
3. AMBA – Bus Architecture
  • 3.1. AXI3
  • 3.2. Cache Coherency - ACP
  • 3.3. ACE-AXI4
  • 3.4. CHI
  • 3.5. AHB
  • 3.6. APB
4. Trace & Debug Architecture
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The information above is preliminary and subjected to change.

Embedded/IoT

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Quantum Computing

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MATLAB - Signal Processing

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FPGA/RTL design – Verilog HDL

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Physical Design

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Design Verification

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AI/ML – Python

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AI/ML – Python

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Benefits and Competitive Advantages of Our Service

Structured Learning Path

A step-by-step approach that builds knowledge and practical skills progressively, from foundational concepts to advanced applications.

Continuous Practice Tests

Reinforce learning and track progress through regular assessments that build confidence, identify knowledge gaps, and ensure steady improvement.

Project-Based Learning

Learners gain critical thinking, problem-solving, and practical skills by actively engaging in real-world projects that apply their knowledge.

1:1 Mentor Support

Provides personalized guidance through regular, focused interactions that support individual growth, skill development, and career alignment.

Career-Focused Roadmaps

Step-by-step guidance aligned with individual goals and industry demands to streamline skill development, certifications, and job readiness.

Interview Insights

We equip you with strategies to tackle technical deep-dives, system-level problem-solving, and Navigate competency-based questions with frameworks that highlight your leadership, problem-solving, and innovation mindset.

Hear It from the Minds We Empower

Your challenges matter — let’s solve them together.

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Everything You Need to Know About HyperTech-Labs

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